The ELS-BODEN 150

ELS-BODEN 50

Key Features:

  • Largest beam current – 800nA
  • 10nm beam spot size at 100nA of beam current
  • 20nm minimal feature size at 1nA
  • Both single cassette or multiple cassette autoloaders are available

HIGHER THROUGHPUT THAN EXISTING EBL SYSTEMS

The ELS-BODEN 50 EBL system reaches sub-micron scales unachievable via laser lithography. Designed for low volume device fabrication with minimal line edge roughness.

Specification

Electron Gun

Acceleration voltage

Beam current

Min. beam spot size

Writing field size

Min. / Max. field size

Scan clock

Min. beam position

Max. sample size

Max.writing area

Loading system

Software

ZrO/W Thermal Field Emitter

50kV

100kV

125kV

150kV

1nA
~800nA

20pA
~100nA

5pA
~100nA

5pA
~100nA

2.8nm

1.8nm

1.7nm

1.5nm

1000µm

1000um

500µm

500µm

Min 100µm square
Max (Option) 3000µm square

200MHz

0.1nm (at standard field)

8" (200mm) wafer / 12" (300mm) wafer (Option)

8" (200mm) square / 12" (300mm) square (Option)

Single autoloader
Multi autoloader
12" (300mm) FOUP robot loader
PEB robot loader

elms

Beam conditions
Exposure schedule
Pattern data converter
Account management
Python scripting

Elionix Lithography Management System

The elms software is a comprehensive electron beam lithography management user interface residing on a Win10 platform.  From full production job scheduling, to SEM UI, to system diagnostics, this software platform is very intuitive to use.