ELS-S50EX

ELS-F125 column

ELS-S50EX

High Performance 50kV Electron Beam Lithography System

The ELS-BODEN 50 EBL system delivers impressive resolution and minimal field stitching error at high beam currents and large writing field sizes. The system serves a wide variety of lithography applications e.g. electronic devices, optical devices, integrated circuits, MEMS parts and more. The system has a space saving small footprint.

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Specification

Electron Gun

Acceleration voltage

Beam current

Min. beam spot size

Writing field size

Min. / Max. field size

Scan clock

Min. beam position

Max. sample size

Max.writing area

Loading system

Software

ZrO/W Thermal Field Emitter

50kV

100kV

125kV

150kV

1nA
~1µA

20pA
~100nA

5pA
~100nA

5pA
~100nA

D5nm

D1.8nm

D 1.7nm

D1.5nm

1000µm

1000um

500µm

500µm

Min lOOµm square
Max (Option) 3000µm square

Max 200MH z

O.lnm (at standard field)

8" (200mm) wafer I 12" (300mm) wafer

8" (200mm) square I 12" (300mm) square

Single autoloader
Multi autoloader
12" (300mm ) FOUP robot loader
PEB robot loader

elms

Beam conditions
Exposure schedule
Pattern data converter
Account management
Python scripting